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Staff Packaging Development Engineer

Staff Packaging Development Engineer

Công Ty TNHH Qorvo Việt NamBac Giang
20 ngày trước
Mô tả công việc

Job description

Overview

Qorvo seeks a seasoned Packaging Development Engineer with a robust background in semiconductor packaging development and integration. This role involves leading new packaging technologies and assembly capabilities, with a focus on SMT process expertise and innovation in packaging solutions.

Working Location :

Candidate must be willing to work at Bac Ninh, Bac Giang

Responsibilities

  • Develop and integrate new semiconductor packaging technologies.
  • Manage technical projects for packaging technology advancement.
  • Serve as a lead expert in packaging assembly processes, especially SMT.
  • Innovate in package design, processes, and materials for next-generation solutions.
  • Offer technical guidance during development phases and address high-volume production challenges.
  • Spearhead projects from concept through to qualification and production in collaboration with R&D.
  • Support technical customer engagements and problem resolution.
  • Drive continuous process improvement (CPI) in packaging and support cross-functional areas.
  • Collaborate with offshore assembly, substrate partners, and suppliers.
  • Present project updates to executive management and contribute to patent creation.

Job requirements

  • Bachelors degree in Mechanical, Microelectronics, or Materials Engineering. Master’s degree in Mechanical, Microelectronics, or Material Engineering preferred .
  • 10+ years experience in packaging or semiconductor assembly.
  • Strong leadership and project management skills in packaging and assembly tech.
  • Expertise in package design and SMT process development.
  • Experience with heterogeneous integration, SiP, and various packaging forms.
  • Proficiency in technology / assembly process development across SMT, Die Attach, Wire Bond, etc.
  • Exceptional communication skills for idea sharing and presenting to large groups.
  • Familiarity with high volume manufacturing, ideally in the cellular handset market.
  • Solid problem-solving skills; Lean and / or Six Sigma certification is a plus.
  • Knowledge of JEDEC, AEC Q100 / 200, and TS16949 automotive standards.
  • Competitive Analysis

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    Price

    29.000đ / time

    What We Can Offer

    Bonus

    Competitive salary and bonus

    Healthcare Plan

    Social insurance, health insurance, unemployment insurance according to Labor Laws

    Training

    Good chance to study and develop career path stably

    Job Information

    POSTED DATE

    04 / 04 / 2025

    JOB LEVEL

    Experienced (non-manager)

    JOB FUNCTION

    Manufacturing >

    Research & Development

    SKILL

    SMT Process Expertise, Semiconductor Packaging, Project Management, Package Design, Semiconductor

    JOB INDUSTRY

    Electrical / Electronics

    PREFERRED LANGUAGE

    YEAR OF EXPERIENCE

    Not required

    NATIONALITY

    Not shown